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HD74HC273
Octal D-type Flip-Flops (with Clear)
Description
This device contains 8 master-slave flip-flops with a common clock and common clear. Data on the D input having the specified setup and hold times is transferred to the Q output on the low to high transition of the clock input. The clear input when low, sets all outputs to a low state.
Features
* * * * * High Speed Operation: tpd (Clock to Q) = 18 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C)
Function Table
Inputs Clear L H H H H L Clock X D X H L X X Outputs Q L H L No change No change
HD74HC273
Pin Arrangement
Clear 1Q 1D 2D 2Q 3Q 3D 4D 4Q
1 2 3 4 5 6 7 8 9
20 VCC
Q Q
19 8Q 18 8D 17 7D 16 7Q 15 6Q 14 6D 13 5D 12 5Q 11 Clock
Clear
D CK
Clear
CK D
D Q
CK
CK
D Q
Clear
Clear
Q
Q
Clear
D CK
Clear
CK D
D Q
CK
CK
D Q
Clear
Clear
GND 10 (Top view)
2
HD74HC273
Logic Diagram
Clock 1D Clear
CK Q CK D CL Q
1Q
2D
D CL
2Q
CK
3D
D CL
Q
3Q
CK
4D
D CL CK
Q
4Q
5D
D CL
Q
5Q
CK
6D
D CL
Q
6Q
CK
7D
D CL
Q
7Q
CK
8D
D CL
Q
8Q
3
HD74HC273
DC Characteristics
Ta = 25C Item Input voltage Symbol VIH Ta = -40 to +85C Max -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 1.0 40 A A I OL = 4 mA I OL = 5.2 mA Vin = VCC or GND Vin = VCC or GND, Iout = 0 A V I OH = -4 mA I OH = -5.2 mA Vin = VIH or VIL I OL = 20 A V Vin = VIH or VIL I OH = -20 A V Unit V Test Conditions
VCC (V) Min Typ Max Min 2.0 4.5 6.0 1.5 -- 3.15 -- 4.2 -- -- -- -- -- -- -- -- -- -- 0.5 1.5 3.15 4.2 --
VIL
2.0 4.5 6.0
1.35 -- 1.8 -- 1.9 4.4 5.9 4.13 5.63 -- -- --
Output voltage
VOH
2.0 4.5 6.0 4.5 6.0
1.9 2.0 -- 4.4 4.5 -- 5.9 6.0 -- 4.18 -- 5.68 -- -- -- -- -- -- -- -- -- --
VOL
2.0 4.5 6.0 4.5 6.0
0.0 0.1 0.0 0.1 0.0 0.1 -- -- -- --
0.26 -- 0.26 -- 0.1 -- 4.0 --
Input current Quiescent supply current
Iin I CC
6.0 6.0
4
HD74HC273
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25C Item Maximum clock frequency Symbol f max Ta = -40 to +85C Max 5 24 28 180 36 31 180 36 31 180 36 31 -- -- -- -- -- -- -- -- -- -- -- -- 95 19 16 10 pF ns ns Clock, clear ns Clear to clock ns Clock to data ns Data to clock ns Clear to Q ns ns Clock to Q Unit MHz Test Conditions
VCC (V) Min Typ Max Min 2.0 4.5 6.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 18 -- -- 18 -- -- 15 -- 6 30 35 -- -- --
Propagation delay t PHL time
2.0 4.5 6.0
145 -- 29 25 -- --
t PLH
2.0 4.5 6.0
145 -- 29 25 -- --
t PHL
2.0 4.5 6.0
145 -- 29 25 -- -- -- -- -- -- -- -- -- -- -- -- 75 15 13 10 -- -- 125 25 21 5 5 5 125 25 21 100 20 17 -- -- -- --
Setup time
t su
2.0 4.5 6.0
100 -- 20 17 5 5 5 2 -- -- 0 --
Hold time
th
2.0 4.5 6.0
Removal time
t rem
2.0 4.5 6.0
100 -- 20 17 80 16 14 -- -- -- -- -1 -- -- 8 -- -- 5 -- 5
Pulse width
tw
2.0 4.5 6.0
Output rise/fall time
t TLH t THL
2.0 4.5 6.0
Input capacitance
Cin
--
5
Unit: mm
24.50 25.40 Max 20 11 7.00 Max 6.30 1 0.89
1.27 Max
10 1.30 2.54 Min 5.08 Max 7.62
0.51 Min
2.54 0.25
0.48 0.10
0.25 - 0.05 0 - 15
+ 0.11
Hitachi Code JEDEC EIAJ Weight (reference value)
DP-20N -- Conforms 1.26 g
Unit: mm
12.6 13 Max
20
11
1
10
5.5
0.80 Max
2.20 Max
*0.22 0.05 0.20 0.04
0.20 7.80 + 0.30 -
1.15
0 - 8
0.70 0.20
1.27 *0.42 0.08 0.40 0.06
0.12 M
*Dimension including the plating thickness Base material dimension
0.10 0.10
0.15
Hitachi Code JEDEC EIAJ Weight (reference value)
FP-20DA -- Conforms 0.31 g
Unit: mm
12.8 13.2 Max 20 11 7.50 1 0.935 Max 10
2.65 Max
*0.27 0.05 0.25 0.04
0.25 10.40 + 0.40 -
1.45
0.20 0.10
0 - 8
0.57 0.70 + 0.30 -
1.27
*0.42 0.08 0.40 0.06
0.15 0.12 M
Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DB Conforms -- 0.52 g
*Dimension including the plating thickness Base material dimension
Unit: mm
6.50 6.80 Max 20 11 4.40 1 10 0.65 0.20 0.06 *0.22+0.08 -0.07 0.13 M 0.65 Max *0.17 0.05 0.15 0.04 1.10 Max 0.07 +0.03 -0.04 0 - 8 0.50 0.10 1.0 6.40 0.20 0.10
*Dimension including the plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value)
TTP-20DA -- -- 0.07 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.

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